Sensor and Detector Interfaces：

Compare Mfr Part # Quantity Available Series Package Product Status Programmable Type Input Type Output Type Current - Supply Operating Temperature Mounting Type Package / Case Supplier Device Package

ZSSC3123AA7T TSSOP / 14 / 4,4MM G1 - TUBE

0

cLite?

Tube

Active

-

Capacitive Sensor

Capacitive

I2C, SPI

1.1 mA

-40°C ~ 125°C (TA)

Surface Mount

14-TSSOP (0.173", 4.40mm Width)

14-TSSOP

ZSC31014EID DICE (WAFER SAWN) - WAFFLE PACK

0

*

Tray

Active

Not Verified

-

-

-

-

-

-

-

-

MCZ33793EFR2 IC DSI SLAVE FOR R-SENSE 16-SOIC

2940

-

Bulk

Active

Not Verified

Sensor Interface

Logic

Logic

250 mA

-40°C ~ 150°C

Surface Mount

16-SOIC (0.154", 3.90mm Width)

16-SOIC

ZSC31150GAB WAFER (UNSAWN) - BOX

0

*

Tray

Active

Not Verified

-

-

-

-

-

-

-

-

ZSC31150GEB WAFER (UNSAWN) - BOX

0

*

Tray

Active

Not Verified

-

-

-

-

-

-

-

-

ZSSC3281BI5B DICE ON 304 MICRO METER WAFER WI

0

-

Tray

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

Surface Mount

Die

Die

ZSSC3281BI2B DICE ON 725 MICRO METER WAFER NO

0

-

Tray

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

Surface Mount

Die

Die

ZSSC3281BI6B DICE ON 725 MICRO METER WAFER WI

0

-

Tray

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

Surface Mount

Die

Die

ZSSC3281BI1B DICE ON 304 MICRO METER WAFER NO

0

-

Tray

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

Surface Mount

Die

Die

MCZ33784EFR2 IC SENSOR DBUS DSI 2.02 16-SOIC

0

-

Tape & Reel (TR)

Active

Not Verified

Sensor Interface

Analog

Quattot

4 mA

-40°C ~ 125°C

Surface Mount

16-SOIC (0.154", 3.90mm Width)

16-SOIC

ZSC31010CED DICE (WAFER SAWN) - WAFFLE PACK

0

*

Tray

Active

Not Verified

-

-

-

-

-

-

-

-

ZSSC3281BC8R SMART SENSOR -> BUMPED DIE

0

-

Tape & Reel (TR)

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

-

-

-

ZSSC4161DE1D DICE (WAFER SAWN) - WAFFLE PACK

0

-

Tray

Active

-

Signal Conditioner

Differential

1-Wire?, I2C

-

-40°C ~ 150°C

Surface Mount

Die

Die

ZSSC3281BI8R SMART SENSOR -> BUMPED DIE

0

-

Tape & Reel (TR)

Active

-

Signal Conditioner

Quattot

1-Wire?, I2C, SPI

15 mA

-40°C ~ 125°C (TA)

-

-

-

ZSC31050FIB WAFER (UNSAWN) - BOX

0

*

Tray

Active

Not Verified

-

-

-

-

-

-

-

-

  • ZSSC3123AA7T

    TSSOP / 14 / 4,4MM G1 - TUBE

    Details

  • ZSC31014EID

    DICE (WAFER SAWN) - WAFFLE PACK

    Details

  • MCZ33793EFR2

    IC DSI SLAVE FOR R-SENSE 16-SOIC

    Details

  • ZSC31150GAB

    WAFER (UNSAWN) - BOX

    Details

  • ZSC31150GEB

    WAFER (UNSAWN) - BOX

    Details

  • ZSSC3281BI5B

    DICE ON 304 MICRO METER WAFER WI

    Details

  • ZSSC3281BI2B

    DICE ON 725 MICRO METER WAFER NO

    Details

  • ZSSC3281BI6B

    DICE ON 725 MICRO METER WAFER WI

    Details

  • ZSSC3281BI1B

    DICE ON 304 MICRO METER WAFER NO

    Details

  • MCZ33784EFR2

    IC SENSOR DBUS DSI 2.02 16-SOIC

    Details

  • ZSC31010CED

    DICE (WAFER SAWN) - WAFFLE PACK

    Details

  • ZSSC3281BC8R

    SMART SENSOR -> BUMPED DIE

    Details

  • ZSSC4161DE1D

    DICE (WAFER SAWN) - WAFFLE PACK

    Details

  • ZSSC3281BI8R

    SMART SENSOR -> BUMPED DIE

    Details

  • ZSC31050FIB

    WAFER (UNSAWN) - BOX

    Details

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